DYMAT (European association for the promotion of research into the dynamic behaviour of materials and its applications)
We were pleasantly surprised by attention paid to the quality of submissions, useful and clear guidelines and high efficiency with which the team of the SHS Web of Conferences (EDP Sciences) works. For us, it is an indisputable indicator of high professionalism.
We are grateful for this cooperation, the opportunity to publish scientific research results of our authors in Conference Proceedings of such a high level. Thank you for this experience, your kindness and patience!
Valentina Mantulenko, Samara State University of Economics, Russia
On behalf of the “Problems of Enterprise Development: Theory and Practice 2018” editor, SHS Web of Conferences vol. 62 (2019)
We have a very good publishing experience with you and the working efficiency is high! All of you are very nice! The conference will be held every one or two years in the future. Looking forward to the future cooperation!
Yongli Guo, Zhenjiang, China
On behalf of the ACEM2018 and SBMS1 Committee, MATEC Web of Conferences vol. 275 (2019)
I would like to mention a very rapid publication within one month from submission!
It was a very clear and easy submission process. I found all articles were published in colours and have DOI Names.
Contributions of our closest conference 'PhiPsi19' will be also published online in EPJ Web Of Conferences!
Dmitry Matvienko, Novosibirsk, Russia
On behalf of the CHARM 2018 Local Organising Committee, EPJ Web of Conferences vol. 202 (2019)
SeFet Team is happy and satisfied for collaborating with E3S Web of Conferences in publication. Excellent job, very informative and clear. Very fast response to any our questions. Thanks! We will deal with you again for the next version of conference! I would like to thank the E3S team for their kind professional and friendly support. The time between submission of papers and online publication was very short. I recommend this publisher to other conference organizers.
Dr. Suresh Kumar Tummala, Gokaraju Rangaraju Institute of Engineering & Technology, Hyderabad, India
On behalf of the SeFet 2019 editors, E3S Web of Conferences vol. 87 (2019)
We would like to thank the Publisher for professional preparation of proceedings, extremely efficient publishing procedure and good communication from your side.
Krzysztof Jóźwiakowski and Magdalena Gajewska,
On behalf of the EEE 2018 editors, E3S Web of Conferences vol. 86 (2019)
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